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DATA SHEET
SKY65135: WLAN Power Amplifier
Applications
* IEEE802.11 b/g WLAN * ISM band * WCS fixed wireless * Wireless access nodes
Description
Skyworks SKY65135 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65135 ideal for Wireless Local Area Network (WLAN) applications. The device is fabricated using Skyworks high reliability Indium Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT) technology. The device is internally matched and mounted in a 20-pin, 6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. The device package and pinout for the 20-pin MCM are shown in Figure 1. A block diagram of the SKY65135 is shown in Figure 2.
Features
* Linear output power of +31 dBm for IEEE802.11b mask * Linear output power of +30 dBm for IEEE802.11g mask * Three percent EVM at POUT >+27 dBm * High gain of 33 dB * Output power detector: 20 dB dynamic range * Superior gain flatness * Internal RF match and bias circuits * Small footprint, MCM (20-pin, 6 x 6 mm) Pb-free (MSL3, 250 C per JEDEC J-STD-020) SMT package Skyworks offers lead (Pb)-free RoHS (Restriction of Hazardous Substances) compliant packaging.
RF_IN
18
GND
GND
GND GND GND VC_BIAS VREF1 VREF2
1
20
19
GND
17
16
VCC1 VCC_DET V_DET VCC2 VDET_CNTL VCC3
2
15
3
14
4
13
5
12
6
7
8
9
10
11
VREF3
GND
RF_OUT
GND
S414
Figure 1. SKY65135 Pinout - 20-Pin MCM (Top View)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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DATA SHEET * SKY65135 WLAN PA
VCC1
VREF1, VREF2 VREF3
VC_BIAS
VCC3
VCC_DET
Active Bias
Detector
V_DET
RF_IN
Input Match Stage 1 PA
Inter-Stage Match
Stage 2 PA
VCC2
Inter-Stage Match
Output Match Stage 3 PA
RF_OUT
S413
Figure 2. SKY65135 Block Diagram
Technical Description
The SKY65135 PA contains all of the needed RF matching and DC biasing circuits. The device also provides an output power detector voltage. The SKY65135 is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications, where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.
Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SKY65135 are provided in Table 2. Electrical specifications are provided in Table 3. Typical performance characteristics are shown in Figures 3 through 11. Figure 12 provides a typical evaluation board schematic. An assembly drawing for the Evaluation Board is shown in Figure 13 and the layer detail is provided in Figure 14. The layer detail physical characteristics are noted in Figure 15. The phone board layout footprint for the SKY65135 is shown in Figure 16. Package dimensions for the 20-pin MCM are shown in Figure 17, and tape and reel dimensions are provided in Figure 18.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY65135 is rated to Moisture Sensitivity Level 3 (MSL3) at 250 C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.
Electrostatic Discharge (ESD) Sensitivity
The SKY65135 is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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DATA SHEET * SKY65135 WLAN PA
Table 1. SKY65135 Signal Descriptions
Pin # 1 2 3 4 5 6 7 8 9 10 GND GND GND VC_BIAS VREF1 VREF2 VREF3 GND RF_OUT GND Name Ground Ground Ground Bias voltage Bias reference voltage 1 Bias referance voltage 2 Bias referance voltage 3 Ground RF output Ground Description Pin # 11 12 13 14 15 16 17 18 19 20 VCC3 VDET_CNTL VCC2 V_DET VCC_DET VCC1 GND RF_IN GND GND Name Description Stage 3 collector voltage Detector voltage control Stage 2 collector voltage Detector output signal Detector supply voltage Stage 1 collector voltage Ground RF input Ground Ground
Table 2. SKY65135 Absolute Maximum Ratings (Note 1)
Parameter RF output power Supply voltage, measured at pin of package (Note 2) 3rd stage supply voltage Total supply current (ICC + IBIAS + IREF) Power dissipation Case operating temperature Storage temperature Junction temperature TC TST TJ -40 -55 POUT VREF1, VREF2, VREF3, VCC1, VCC2, and VCC_DET VCC3, VC_BIAS ICC_TOTAL Symbol Minimum Maximum 30 4 Units dBm V
6 1200 4.0 +85 +125 +150
V mA W C C C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Note 2: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 12.
Table 3. SKY65135 Recommended Operating Conditions
Parameter RF input power Supply voltage, measured at pin of package (Note 1) PIN VREF1, VREF2, and VREF3 VCC1 and VCC2 VCC_DET VCC3 and VC_BIAS Case operating temperature Storage temperature TC TST 2.3 3.0 3.3 4.5 -40 -55 2.5 3.3 3.6 5.0 Symbol Minimum Typical Maximum -6 2.7 3.6 3.9 5.5 +85 +125 Units dBm V V V V C C
Note 1: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 12.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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DATA SHEET * SKY65135 WLAN PA
Table 4. SKY65135 Electrical Specifications (VCC1 = VCC2 = 3.3 V, VCC3 = 5 V, TC = +25 C, Test Frequency = 2.442 GHz unless otherwise noted)
Parameter Symbol Test Condition Min Typical Max Units
Using IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps Total supply current Output power (Note 1) Power added efficiency (Note 2) Ramp-up/ramp-down (Note 3) ICC_TOTAL POUT PAE TS 1150 31 25 <0.5 mA dBm % s
Using IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps Total supply current Output power (Note 4) Output power @ EVM = 3% Power added efficiency (Note 2) Using Continuous Wave Input Signals Small signal gain Gain flatness over band Gain flatness over channel (16.25 MHz) Output power @ 1 dB compression Output IP3 Quiescent Current Noise Figure Power added efficiency @ P1dB P1dB OIP3 IQ NF PAE 25 G PIN = -25 dBm From 2.4 GHz to 2.5 GHz Over any 16.25 MHz within band PIN = 0 dBm PTONE = +27 dBm, Delta_freq = 5 MHz No RF input 32 31.5 33 0.5 0.1 33 42 400 5 34 450 6 34.5 dB dB dB dBm dBm mA dB % ICC_TOTAL POUT POUT_EVM PAE 1050 30 27 22 mA dBm dBm %
Note 1: Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met. Note 2: Measured at the specified average output RF power and modulation type. Note 3: Ramp-up and ramp-down times are defined from the 10% to 90% power points. Note 4: Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met.
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DATA SHEET * SKY65135 WLAN PA
36
35.0
35
34
34.0
Gain (dB)
33
32
Gain (dB)
33.0 32.0
31
30 10 12 14 16 18 20 22 24 26 28 30 32 34
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
POUT (dBm)
Frequency (GHz)
Figure 3. Typical Gain vs POUT @ 2.442 GHz
Figure 4. Typical Gain vs Frequency Response
6.0 5.8 5.6
+10
Relative Power (dB)
0
IEEE802.11g Specification Mask
Noise Figure (dB)
5.4 5.2 5.0 4.8 4.6 4.4 4.2 4.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
-10
-20
-30
POUT = +30 dBm
-40
-50 2.411
2.417
2.423
2.430
2.436
2.442
2.448
2.454
2.461
2.467
2.473
Frequency (GHz)
Frequency (GHz)
Figure 5. Typical Noise Figure Performance vs Frequency
Figure 6. Output Spectrum Response for 802.11g @ 2.442 GHz and POUT = 30 dBm
+10 0
1.8 1.6
IEEE802.11b Specification Mask
Relative Power (dB)
1.4
Detector Voltage (V)
2.467 2.473
-10 -20 -30 -40
POUT = +31 dBm
1.2 1.0 0.8 0.6 0.4 0.2
-50 -60 2.411 2.417 2.423 2.430 2.436 2.442 2.448 2.454 2.461
0 10 12 14 16 18 20 22 24 26 28 30 32 34
Frequency (GHz)
POUT (dBm)
Figure 7. Output Spectrum Response for 802.11b CCK-Coded @ 2.442 GHz and POUT = 31 dBm
Figure 8. Detector Output Voltage vs RF Output Power @ 2.442 GHz
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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DATA SHEET * SKY65135 WLAN PA
6.0 5.5 5.0 4.5
1000 900 800 700
Current (mA)
EVM (%)
4.0 3.5 3.0 2.5 2.0
600 500 400 300 200
x
ICC_TOTAL ICC1 ICC2 ICC3
xx xx xx xx xxx
x
1.5 1.0 0.5 23 24 25 26 27 28 29
100 0 14 16 18 20 22 24 26 28 30
Output Power (dBm)
Output Power (dBm)
Figure 9. EVM vs POUT for 802.11g
Figure 10. Individual Stage Currents and Total Current vs RF Output Power
40 35 30 25
PAE (%)
20 15 10 5 0 14 16 18 20 22 24 26 28 30 32 34
Output Power (dBm)
Figure 11. PAE vs Output Power
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DATA SHEET * SKY65135 WLAN PA
20
19
18
17
C5 8.2 pF
C15 10 F
Collector Voltage (Stage 1)
RF_IN
GND
GND
GND
1
GND GND
VCC1
16
L1 300 C6 3300 pF L2 27 nH
2
VCC_DET
15
Detector Supply Voltage
3 4
C11 10 F C1 8.2 pF R1 750 C12 DNI C2 8.2 pF
GND
VDET
14
Detector Output
C7 8.2 pF
SKY65135
VC_BIAS VCC2
13
C8 8.2 pF C16 10 F
Bias Voltage
Collector Voltage (Stage 2)
Reference Voltage 1 Reference Voltage 2
5
VREF1
RF_OUT VREF3
VDET_CNTL
GND GND
12
R2 200 C13 DNI C3 8.2 pF R3 270 C14 DNI C4 8.2 pF
6
VREF2
VCC3
11
L3 0 C9 270 pF
R4 51
Reference Voltage 3
10
7
8
9
C10 8.2 pF
C17 10 F
Collector Voltage (Stage 3)
Note: Evaluation Board material: four-layer Rogers 4003-12, r = 3.38. Some component labels may be different than the corresponding component symbol shown here. Component values, however, are accurate as of the date of this Data Sheet. S702
Figure 12. SKY65135 Evaluation Board Schematic
C5 C11 C1 C12 C2
C15 C6 L1 C7 L2
J3
C13 C3
R1 L3
C8 C16 R4
J4
R2 C14 C4 R3 C10 C17
C9
J2
S588
Figure 13. Evaluation Board Assembly Drawing
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DATA SHEET * SKY65135 WLAN PA
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
S590
Figure 14. Evaluation Board Layer Detail
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DATA SHEET * SKY65135 WLAN PA
Cross Section
Name Thickness (mils) Material
L1 Lam1 L2_GND Lam2 L3_GND Lam3 L4 1.4 12 1.4 4 1.4 12 1.4 Cu, 1 oz. Rogers 4003-12 Cu, 1 oz FR4-4 Cu, 1 oz. FR4-12 Cu, 1 oz.
r
- 3.38 - 4.35 - 4.35 -
S573
Figure 15. Layer Detail Physical Characteristics
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DATA SHEET * SKY65135 WLAN PA
Pin 20 Pin 1
20X 0.75
20X 0.5
2X 1.7
6.3
1.0 Typical Stencil aperture size for center ground pads should be 80% to 100% (by area) of the solder mask opening.
Component outline 2X 1.7 6.3
Thermal Via Array 0.3 mm on 0.6 mm pitch. Additional vias will improve thermal performance.
20X 0.75 Pin 20 Pin 1 0.25 Typical
Stencil Aperture Top View
Pin 20 Pin 1 20X 0.5 20X 0.85
20X 0.6
0.6 Typical 6.3 2X 1.7
1.0 Typical
6.4
1.0 Typical
Component outline
0.6 Typical 6.3
Component outline 2X 1.7 6.4
Metallization Top View
All measurements are in millimeters Note: Thermal vias should be tented and filled with solder mask: 30 to 35 m Cu plating recommended.
Solder Mask Opening Top View
S965
Figure 16. SKY65135 Phone Board Layout Footprint
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DATA SHEET * SKY65135 WLAN PA
2X 1.9
12X 2.9
4X 0.5
4X 1.5
Pin 20
(2.075)
(0.3) Solder Mask Opening
0.15 Metal Pad
Pin 1
6
B C 4X 2.5
Pin 1 Indicator
(2.75)
Pin 1
4X 1.5 4X 0.5 6
A
2X 1.9 8X 2.9
20X SMT Pad
A
0.15 A B C
1.45 0.1
4X R0.2
0.1
Solder Mask Opening
0.2 A B C
0.15 A B C
Top View
Side View
0.5 0.1 0.1
Bottom View
0.5 0.05
Metal Pad Edge All dimensions are in millimeters Dimensioning and tolerancing according to ASME Y14.5M-1994
Detail A
S416
Figure 17. SKY65135 20-Pin MCM Package Dimensions
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DATA SHEET * SKY65135 WLAN PA
2.00 0.05 1.55 0.05 0.30 0.05 Pin #1 Indicator 8.00 4.00
B
1.75 0.10
5.50 0.05
A
6.30
A
5o Max. 1.70
B
1.50 Min. 6.30
B
Notes: 1. Carrier tape: black conductive polystyrene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. All dimensions are in millimeters
5o Max.
A
C1222
Figure 18. SKY65135 20-Pin MCM Tape and Reel Dimensions
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12.00 0.30
DATA SHEET * SKY65135 WLAN PA
Ordering Information
Model Name SKY65135 WLAN Power Amplifier Manufacturing Part Number SKY65135-21 (Pb-free package) Evaluation Kit Part Number TW13-D122
Copyright (c) 2005, 2006, 2007 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and "Breakthrough Simplicity" are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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